Different sunlight aging electronic potting

 Electronic potting belong in the uncured liquid, liquid, glue viscosity depending on the material , performance, production processes and products differ .

Difficult sunlight aging characteristics of electronic potting :

    1, the semi- solidified glue curing , good adhesion to many substrates and sealing performance, with very excellent anti alternating hot and cold performance.

    2 , after mixing the two components is not fast gel , and thus have a longer operating time , once the heat will quickly curing, curing time can be freely controlled .

    3 , the curing process without a by-product , no shrinkage .

    4, with excellent electrical insulating properties and resistance to high- temperature performance (-50 ℃ ~ 200 ℃).

    5 , the gel can be cracked by the force automatically heal , also play a waterproof , moisture-proof effect, does not affect the results.

    Difficult sunlight aging electronic potting in order to achieve full cure after its use value , after curing can play a waterproof, dustproof, insulation, thermal conductivity , confidentiality, anti-corrosion , heat , shock effect.

Aging sunlight difficult part of an electronic potting electronic potting , and many types of electronic potting , are: thermal conductivity potting , epoxy encapsulants , silicone sealant , polyurethane potting plastic , LED encapsulants .

Sunlight is difficult to use electronic potting aging methods and precautions :

    Before mixing , the first component A proper use of manual or mechanical agitation , component B should be fully shake the container in a sealed state , and then to use.

    • When you need to attach to the application materials, please confirm before use can be attached , and then apply .

    • mixed, according to the weight ratio ratio, response to changing the mixing ratio of simple experiments carried out after application . Usually the amount of component B , the more the curing time is short , the shorter the operating time.

    • Generally, the thickness of 10mm or less potting degassing naturally without further degassing . If large potting thickness, surface and internal pinholes or bubbles may occur , therefore, should put the mixture into the vacuum container, degassed under 700mmHg at least five minutes .

    • The higher the temperature , the faster the cure , the shorter the operating time. Heat curing is generally not recommended to avoid surface and internal pinholes or bubbles , affect the appearance and sealing performance.

    • former small molecules generated during the curing process is not fully released , potting devices do not completely closed , plus the high temperature (> 100 ℃). Completely closed if necessary , in the Guangdong region , the proposed summer 3 days , 7 days before the winter be closed . After the initial curing adhesive may take appropriate heating ( temperature does not exceed 60℃) ways to accelerate the curing .