Electronic Potting and Encapsulating Silicone Rubber Component

MC Silicone Potting Material for Electronics

Silicone Potting Compound and Encapsulant

 

Description

 

RTV160 is a two-component room temperature cure potting compound with mix ratio of 1:1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It’s suitable for encapsulating of LED displayers, power module and electronics components, etc.

 

 

Features

 

Easy mix with 1:1 proportion

Low viscosity, good flow ability

Room temperature cure or heat up cure

Thermal conduction, flame resistance

Without solvent

 

 

Using Instructions

 

1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.

 

1. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.

 

1. Curing: room temperature cure or heat-up cure is both workable.

 

1. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.

 

 

Technical datasheet

 

Item No.	RTV160
Before curing
Appearance	A:grey  B: white
Viscosity (mPa.s 25℃)	3000~6000
Density  (g/cm3 )	1.57±0.02
Working life  (min 25℃)	30
Curing time  (hrs)	24
Heat-up at 100℃  (min)	10
After curing
Hardness  (shore A)	55~60
Dielectric breakdown voltage kv/mm 25℃	≥20
Volume resistivity   ohm*cm	3*1015
Tensile Strength  Mpa	≥0.6
Thermal conductivity   w/m	0.58
Working temperature   ℃	-30~200

 

Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.

 

Packaging

 

Packs are available in 20kg and 200kg per drum.

 

Storage & Transportation

 

1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.