MC Silicone Potting Material for Electronics

Features

Easy mix with 1:1 proportion

Low viscosity, good flow ability

Room temperature cure or heat up cure

Thermal conduction, flame resistance

Without solvent

Using Instructions

1. Preparing: clean up the coating surface, remove the rust, dust, oil dirt.

1. Pouring: weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.

1. Curing: room temperature cure or heat-up cure is both workable.

1. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.

Technical datasheet

Note: Mechanical and electrical performance data tested at 25°C 7 days after curing, relative humidity of 55%; all the tested data is average value.

Packaging

Packs are available in 20kg and 200kg per drum.

Storage & Transportation

1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.